2023 3rd International Symposium on Artificial Intelligence and Intelligent Manufacturing (AIIM 2023)
About AIIM 2023

The 2023 3rd International Symposium on Artificial Intelligence and Intelligent Manufacturing (AIIM 2023) will be held online during Oct. 27-29, 2023. The conference will focus on the themes of Artificial Intelligence, Intelligent Manufacturing, Intelligent Control Systems, and Machine Learning. The primary goal of the conference is to promote research and developmental activities in Artificial Intelligence and Intelligent Manufacturing. Another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners worldwide. The conference will be held annually to make it an ideal platform for people to share views and experiences in Artificial Intelligence Intelligent Manufacturing and related areas.

Important Dates

Full Paper Submission Date:Sep. 5, 2023

Registration Deadline: Sep. 16,  2023

Final Paper Submission Date: Oct. 2,  2023

Conference Dates: Oct. 27-29, 2023

Publication

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All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings by IEEE (ISBN: 979-8-3503-9383-5), and submitted to IEEE Xplore, EI Compendex, Scopus for indexing.


AIIM 2022 has indexed by EI Compendexmicroscope.158df312.png

AIIM 2022 has been published by Journal of Physics: Conference Series (JPCS) (ISSN:1742-6596) → Clickmicroscope.158df312.png

AIIM 2021 丨EI Indexmicroscope.158df312.png Scopus Indexmicroscope.158df312.png


Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

Conference Review
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